Previous company name
Name change date
Electroglas, Inc. is a publicly quoted company engaged in the supply of semiconductor manufacturing equipment and software to the semiconductor industry worldwide. The company was founded in 1960 and has its registered head office located in San Jose, California. It is traded on the NASDAQ National Market under the ticker symbol “EGLS”.
Electroglas, Inc. is known as one of the largest suppliers of automatic wafer probing equipment worldwide that ships more than 15,000 systems across the globe. It manufactures automated wafer probing equipment and related network software to manage information. It offers a range of wafer probing equipment, including Horizon 4000 Series, a wafer prober system for 200mm wafers; EG6000 300mm probing system that employs precision direct-drive technology; and Parametric Probers targeted at the parametric test segment of the wafer probe market. In addition to its offers, Electroglas provides various test floor management software products, including SORTmanager that enables a Web-based environment for the analysis, reporting, and control of sort-floor processes. The company’s wafer probers and network software are used by semiconductor manufacturing customers to quality test semiconductor wafers.
Electroglas markets its products to semiconductor manufacturers and contract test companies through direct sales force and distributors in North America, Europe, and Asia. It has offices located throughout these continents. Among the company’s customers are leading global semiconductor companies such as Intel, Texas Instruments, ST Microelectronics, Micron, NXP, ASET, Amkor, Cypress, SMIC, Seagate, National Semi, Lattice, KYEC, Triquint, Maxim and International Rectifier.
Electroglas Inc is a supplier of semiconductor manufacturing equipment and software to the global semiconductor industry. The Company’s primary product line is automated wafer probing equipment and related network software to manage information from that equipment. The Company’s products include Horizon 4000 Series, EG6000, EG6000t, Parametric Probers and SORTmanager. In July 2008, the Company introduced a new product, EG6000t. In July 2009, the Company filed a voluntary petition under Chapter 11 of the United States Bankruptcy Code.
Description and history
Electroglas Inc, incorporated in April 1993, is a supplier of semiconductor manufacturing equipment and software to the global semiconductor industry. The Company’s primary product line is automated wafer probing equipment and related network software to manage information from that equipment. The Company’s products include Horizon 4000 Series, EG6000, EG6000t, Parametric Probers and SORTmanager. In July 2008, the Company introduced a new product, EG6000t. In July 2009, the Company filed a voluntary petition under Chapter 11 of the United States Bankruptcy Code.
Horizon 4000 Series
The 4090 + (4090 Micro Plus) is the Company’s extended performance wafer prober system for 200 millimeter wafers. The 4090 + addresses the demands of testing fine pitch devices, semiconductors with copper interconnects and low k dielectric processes, and other advanced applications. Employing MicroTouch, a feature that decreases the impact force as the probe pins contact the bond pads, the 4090 + reduces touchdown damage that can occur when testing fragile copper and low k devices or when pads are located over active circuit geometry. The 4090 + increases test cell availability and throughput while simultaneously reducing test cost by making improvements in how probe-to-pad alignment is maintained in varying temperature environments. In addition, the 4090 + has simplified and fully automated operations for high volume manufacturing applications, such as those that exist in integrated device manufacturer (IDM) and contract test facilities.
The EG6000 300 millimeter probing system from Electroglas is a 300 millimeter prober that employs precision direct-drive technology. Designed for advanced applications, such as copper and low k dielectrics, the system employs a stage and control technology enabling accurate positioning of the test devices while moving devices into contact with the probes for test. MicroTouch adds the ability to control the impact forces while probing on delicate devices. In addition, active vibration cancellation technology reduces internally and externally generated vibrations while maintaining the integrity of the connection between devices under test and the probe pins, which can improve test yield. The EG6000 features the Advanced Vision System for accuracy, robustness and speed in aligning devices to the probe card for test. It also features a sophisticated system for automatically measuring and compensating for thermal changes in the system components while testing at hot or cold temperatures. The EG6000 features a range of application capabilities, as well as many refinements and improvements in accuracy, throughput, automation, portability, and reliability.
The EG6000t is the second generation of the Company’s flagship 300millimeter wafer prober product line that fuses automation and reliability requirements of high volume manufacturing environments with the caliber of prober technology. The EG6000t combines improved probe card finding optics, increased wafer pre-align, cassette loading and mapping speeds together with increased loader pre-alignment accuracy to produce smooth, fast and precise operation. The EG6000t also provides a new generation of overall z accuracy with grid-based wafer surface mapping and advanced probe-to-pad alignment optics and algorithms. Along with increased z accuracy, when implemented with the MicroTouch feature that allows for precise control of z-stage velocities, it enables the EG6000t to reduce overall damage to aluminum capped copper pads, low k dielectrics, circuitry under pads, in addition to extending the life of probe cards used on the tool during production.
The EG6000e is targeted at the parametric test (e-test) segment of the wafer probe market. This system incorporates technology licensed from Cascade Microtech, Inc. This technology allows precise, low-level electrical measurements to be made at the wafer level.
Electroglas’ SORTmanager provides that bridge, enabling a secure, Web-based environment for the analysis, reporting and control of sort-floor processes. Data about test results, binning, prober performance and throughput can be collected from all SORTmanager-connected wafer probers, and this information can then be delivered through dynamic and interactive Web pages that allow users to view the underlying data or perform additional analysis. Web publishing capabilities allow Web reports to be created and distributed throughout an enterprise.
The Company competes with Tokyo Electron Limited and Tokyo Seimitsu.
Engaged in the supply of semiconductor manufacturing equipment and software to the semiconductor industry worldwide
EGSOFT HOLDINGS CORPORATION
US SIC Code
5729, Fontanoso Way
City province or state postal code
95138, SAN JOSE, CA
Phone: +1 408 528 3000
Fax: +1 408 528 3542
Country address: UNITED STATES OF AMERICA
Website url: www.electroglas.com