NOVELLUS SYSTEMS INC
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Novellus Systems Inc is a leading manufacturer of advanced thin film deposition, surface preparation and chemical mechanical planarization equipment used in fabricating integrated circuits. The company develops, manufactures, sells and supports equipment used in the fabrication of integrated circuits. The company was founded by Brad Mattson in 1984. Its headquarters is located in San Jose, California in the USA.
The company is a leading supplier of chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), chemical mechanical planarization (CMP), ultraviolet thermal processing (UVTP), and surface preparation equipment used in the manufacturing of semiconductors.
Semiconductor device manufacturers use some of its CVD systems to deposit thin films of insulating materials, called dielectrics, using either a plasma-enhanced chemical vapor deposition (PECVD) process or a high-density plasma chemical vapor deposition process (HDP CVD). For certain types of dielectric films used in very high performance devices, a post-deposition treatment (UVTP) may also be required. The company also makes a CVD system that’s used to deposit conductive tungsten films (W-CVD). It also offers a physical vapor deposition (PVD) system that’s used to deposit aluminum layers on chips that use this conductive metal, as well as copper barrier/seed layers on chips that use copper wiring.
The company’s electrochemical deposition (ECD) product is used to build the copper wires on copper chips, and its chemical mechanical planarization (CMP) product is used to polish the surface of the wafer in order to keep it flat. Finally, its surface preparation products are used to clean the wafer in-between manufacturing process steps, removing residues and contaminants.
The company manufactures its products in San Jose, California and Portland, Oregon. In addition to other sales and support offices in the U.S., Novellus has offices in 16 countries including the United Kingdom, France, Germany, The Netherlands, Ireland, Israel, Italy, India, China, Japan, Korea, Malaysia, Singapore and Taiwan.
Novellus Systems, Inc. develops, manufactures, sells and supports equipment used in the fabrication of integrated circuits, which are called chips or semiconductors. Customers manufacture chips for sale or for incorporation in their own products, or provide chip-manufacturing services to third parties. Novellus Systems, Inc., also develops, manufactures, sells and supports grinding, lapping and polishing equipment for a range of industrial applications. The Company operates in two segments: the Semiconductor Group and the Industrial Applications Group The Company’s advanced deposition systems use chemical vapor deposition (CVD), physical vapor deposition (PVD), and electrochemical deposition (ECD) processes to form transistor, capacitor, and interconnect layers in an integrated circuit. The Company’s High-Density Plasma CVD (HDP-CVD) and Plasma-Enhanced CVD (PECVD) systems employ chemical plasma to deposit dielectric material within the gaps formed by the etching of aluminum.
Description and history
Novellus Systems, Inc., develops, manufactures, sells and supports equipment used in the fabrication of integrated circuits, which are called chips or semiconductors. Customers manufacture chips for sale or for incorporation in their own products, or provide chip-manufacturing services to third parties. Novellus Systems, Inc., also develops, manufactures, sells and supports grinding, lapping and polishing equipment for a range of industrial applications. The Company operates in two segments: the Semiconductor Group and the Industrial Applications Group The Company’s advanced deposition systems use chemical vapor deposition (CVD), physical vapor deposition (PVD), and electrochemical deposition (ECD) processes to form transistor, capacitor, and interconnect layers in an integrated circuit. The Company’s High-Density Plasma CVD (HDP-CVD) and Plasma-Enhanced CVD (PECVD) systems employ chemical plasma to deposit dielectric material within the gaps formed by the etching of aluminum, or as a blanket film which can be etched with patterns for depositing conductive materials into the etched dielectric.
Novellus Systems, Inc. offers products that address the needs of manufacturers across a number of different deposition technologies, such as CVD, PVD and ECD. Novellus Systems, Inc. offers a range of processing systems for dielectric and metal deposition. The Company’s concept two platform is a modular, integrated production system capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers with a common, automated wafer handler. The concept two enabled semiconductor device manufacturers to increase production throughput and system capability by adding process modules, without having to replace existing equipment. The Company’s concept three platform is built on the foundation of Concept Two to offer greater throughput in 300-millimeter wafer manufacturing applications.
In the CVD process, manufacturers place wafers in a reaction chamber, introduce a variety of metered gases into the chamber, and then add a form of energy to activate a chemical reaction that deposits a film on the wafers. Manufacturers also use CVD to deposit conductive metal layers, particularly tungsten.
The SPEED NExT system for 300 millimeter wafers is designed specifically to address the challenges of dielectric gap fill at 65 nanometers. SPEED Max offers processing flexibility and productivity advantages over the SPEED NExT system, and extends the HDP CVD application to the 45 and 32 nanometers technology nodes.
The ALTUS DirectFill tungsten nitride/tungsten deposition system is designed for advanced contact and via-fill applications at 65 nanometers and below. ALTUS DirectFill simplifies the tungsten deposition process by replacing the multi-tool approach with a single three-module system. The ALTUS Max CVD tungsten deposition system delivers advanced contact and via fill technology in a high-productivity platform that delivers more than 120 wafers-per-hour throughput.
VECTOR is a PECVD system for depositing dielectric films on 300 millimeter wafers. The VECTOR Express, optimized for deposition of thin films of less than 1000 angstroms; the VECTOR Express AHM for ashable hard mask film deposition, and the VECTOR Extreme, designed for the demands of high-volume memory megafabs.
SOLA is an ultraviolet thermal processing system (UVTP) used for the low-temperature, post-deposition treatment of dielectric films. SOLA is designed for advanced materials, such as high-stress nitrides and porous low-k dielectrics that are used to deliver increased device speeds and lower power consumption in sub-90 nanometer chips.
INOVA NExT is a 300-millimeter metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target Hollow Cathode Magnetron (HCM) technology has been extended to the 45 nanometer node. INOVA NExT HCM IONX incorporates a copper resputtering technology called HCM IONX.
The Company’s Electrofill products are used to build the copper primary conductive wires in advanced integrated circuits. Electrofill uses a copper electrolytic solution to create lines and vias in a dielectric layer, which has been etched with the pattern of the circuitry, in a process called copper damascene. The SABRE NExT offers a new anode cell design and other hardware refinements to tackle the complex process requirements of 90 nanometer, 65 nanometer and 45 nanometer interconnect structures. The SABRE Extreme is an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. In October 2009, the Company introduced SABRE Excel, an electroplating system designed to provide industry-leading fill and defect density performance for the 22 nanometer technology node and beyond.
Novellus Systems, Inc.’s GAMMA Express is a high productivity resist strip system designed to meet the technology requirements for 45 nanometer manufacturing. GAMMA Express performs high dose implant strip (HDIS) and incorporates non-oxidizing processes for advanced silicides and low-k dielectric films. The redesigned GAMMA Express platform offers a new direct-drive wafer handling subsystem, as well as a new high ash rate source.
Industrial Applications Group
Novellus Systems Inc.’s Industrial Applications Group supplies high-precision machines for grinding, deburring, lapping, honing and polishing the outer surfaces of parts made of metal, glass, ceramic, plastic, silicon or similar materials. The Company’s customers are manufacturers in sectors, such as automotive, aircraft and electronic products, parts and components. Other customers are in the glass and ceramics industries, as well as manufacturers of products, such as pumps, transmissions, compressors and bearings. The industrial product range includes single and double-sided grinding, lapping and polishing machines; double-sided machines, which operate in batch processing mode for flat surfaces; inner and outer diameter surface grinders for cylindrical surfaces, creep feed grinders, as well as through-feed grinders and deburring systems that feature a continuous feed of parts to be processed.
The Company competes with Applied Materials, Inc., ASM International, Mattson Technologies, Inc. and PSK, Inc.
Founded by Brad Mattson
Evelops, manufactures, sells and supports equipment used in the fabrication of integrated circuits
ANGSTRON SYSTEMS, INC
ERNST & YOUNG LLP
US SIC Code
4000, North First Street
City province or state postal code
95134, SAN JOSE, CA
Phone: +1 408 943 9700
Fax: +1 408 943 0202
Country address: UNITED STATES OF AMERICA
Website url: www.novellus.com